[IEEE 2015 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2015.8.31-2015.9.2)] 2015 International 3D Systems Integration Conference (3DIC) - Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module
Lee, Hyunsuk, Cho, Kyungjun, Kim, Heegon, Choi, Sumin, Lim, Jaemin, Kim, JounghoYear:
2015
Language:
english
DOI:
10.1109/3dic.2015.7334555
File:
PDF, 467 KB
english, 2015