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[IEEE 2015 17th European Conference on Power Electronics and Applications (EPE '15 ECCE Europe) - Geneva, Switzerland (2015.9.8-2015.9.10)] 2015 17th European Conference on Power Electronics and Applications (EPE'15 ECCE-Europe) - Small junction temperature cycles on die-attach solder layer in IGBT
Lai, Wei, Chen, Minyou, Ran, Li, Xu, Shengyou, Gao, Bing, Jiang, NanYear:
2015
Language:
english
DOI:
10.1109/epe.2015.7309301
File:
PDF, 586 KB
english, 2015