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[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Analysis of copper plating layer discoloration caused by petal-shaped clusters morphology
Zheng, Yuwei, Bao, Shengxiang, Rao, Zhenzhen, Zhang, Chengshi, Yan, YaoYear:
2015
Language:
english
DOI:
10.1109/icept.2015.7236806
File:
PDF, 2.13 MB
english, 2015