Misaligned Flip-Chip Solder Joints: Prediction and...

Journal of Electronic Packaging 2002 Vol. 124; Iss. 3

Misaligned Flip-Chip Solder Joints: Prediction and Experimental Determination of Force-Displacement Curves

Josell, D., Wallace, W. E., Warren, J. A., Wheeler, D., Powell, A. C.
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Volume:
124
Year:
2002
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1463732
File:
PDF, 277 KB
english, 2002
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