SPIE Proceedings [SPIE Microlithography 2005 - San Jose, CA (Sunday 27 February 2005)] Advances in Resist Technology and Processing XXII - A comparison of new thick photoresists for solder bumping
Flack, Warren W., Nguyen, Ha-Ai, Neisser, Mark, Sison, Ernesto, Lu, Ping Hung, Plass, Bob, Makii, Toshimichi, Murakami, Yoshio, Sturtevant, John L.Volume:
5753
Year:
2005
Language:
english
DOI:
10.1117/12.598469
File:
PDF, 701 KB
english, 2005