Microstructure and creep properties of Sn‐Ag‐Cu lead‐free...

Soldering & Surface Mount Technology 2010 / 04 Vol. 22; Iss. 2

Microstructure and creep properties of Sn‐Ag‐Cu lead‐free solders bearing minor amounts of the rare earth cerium

Zhang, Liang, Xue, Song‐bai, Gao, Li‐li, Chen, Yan, Yu, Sheng‐lin, Sheng, Zhong, Zeng, Guang
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Volume:
22
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540911011036262
Date:
April, 2010
File:
PDF, 376 KB
english, 2010
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