Surface modification of polyimide films by argon plasma for...

Surface modification of polyimide films by argon plasma for copper metallization on microelectronic flex substrates

Yung-Sen Lin, Huang-Ming Liu, Hsuan-Ta Chen
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Volume:
99
Year:
2006
Language:
english
Pages:
12
DOI:
10.1002/app.22545
File:
PDF, 425 KB
english, 2006
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