Improving the fatigue life of a bare die flip chip by...

Soldering & Surface Mount Technology 2003 / 12 Vol. 15; Iss. 3

Improving the fatigue life of a bare die flip chip by thinning

Alander, T., Suominen, I., Heino, P., Ristolainen, E.
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Volume:
15
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910310505062
Date:
December, 2003
File:
PDF, 379 KB
english, 2003
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