Local melt process of solder bumping by induction heating...

Soldering & Surface Mount Technology 2009 / 09 Vol. 21; Iss. 4

Local melt process of solder bumping by induction heating reflow

Xu, Hongbo, Li, Mingyu, Fu, Yonggao, Wang, Ling, Kim, Jongmyung
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Volume:
21
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910910989439
Date:
September, 2009
File:
PDF, 525 KB
english, 2009
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