![](/img/cover-not-exists.png)
Fine Pitch Surface Mount Technology Assembly with Lead‐free, Low Residue Solder Paste
Artaki, I., Jackson, A.M., Vianco, P.T.Volume:
7
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/eb037896
Date:
February, 1995
File:
PDF, 634 KB
english, 1995