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[IEEE 2016 Pan Pacific Microelectronics Symposium (Pan Pacific) - Big Island, HI, USA (2016.1.25-2016.1.28)] 2016 Pan Pacific Microelectronics Symposium (Pan Pacific) - Nano anchoring copper foil for next generation printed wiring boards
Suzuki, Osamu, Yoshi, Akito, Tsubura, Hironobu, Sato, Makiko, Obata, Naoki, Kokaji, YoshinobuYear:
2016
Language:
english
DOI:
10.1109/PanPacific.2016.7428430
File:
PDF, 2.03 MB
english, 2016