Effects of formaldehyde to urea mole ratio on thermal...

Effects of formaldehyde to urea mole ratio on thermal curing behavior of urea–formaldehyde resin and properties of particleboard

Byung-Dae Park, Eun Chang Kang, Jong Yong Park
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Volume:
101
Year:
2006
Language:
english
Pages:
6
DOI:
10.1002/app.23538
File:
PDF, 89 KB
english, 2006
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