![](/img/cover-not-exists.png)
Effects of formaldehyde to urea mole ratio on thermal curing behavior of urea–formaldehyde resin and properties of particleboard
Byung-Dae Park, Eun Chang Kang, Jong Yong ParkVolume:
101
Year:
2006
Language:
english
Pages:
6
DOI:
10.1002/app.23538
File:
PDF, 89 KB
english, 2006