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Reliability of flip chip components soldered on FR5 board
Määttänen, Jarmo, Palm, Petteri, Tuominen, AulisVolume:
17
Language:
english
Journal:
Microelectronics International
DOI:
10.1108/13565360010306038
Date:
April, 2000
File:
PDF, 371 KB
english, 2000