Displacement of Components and Solder during Reflow...

Displacement of Components and Solder during Reflow Soldering

Klein Wassink, R.J., van Gerven, J.A.H.
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Volume:
1
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/eb037658
Date:
January, 1989
File:
PDF, 580 KB
english, 1989
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