Thermal‐mechanical Processing and Repairability Observations for FR‐4, Cyanate Ester and Cyanate Ester/Epoxy Blend PCB Substrates
Fehrer, F., Haddick, G.Volume:
19
Language:
english
Journal:
Circuit World
DOI:
10.1108/eb046201
Date:
January, 1993
File:
PDF, 572 KB
english, 1993