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[IEEE 2013 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2013.10.2-2013.10.4)] 2013 IEEE International 3D Systems Integration Conference (3DIC) - Implementing wireless communication links in 3-D ICs utilizing wide-band on-chip meandering microbump antenna
Lu, Julia Hsin-Lin, Loke, Wing-Fai, Peroulis, Dimitrios, Jung, ByunghooYear:
2013
Language:
english
DOI:
10.1109/3dic.2013.6702334
File:
PDF, 439 KB
english, 2013