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[IEEE 2015 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2015.8.31-2015.9.2)] 2015 International 3D Systems Integration Conference (3DIC) - Power saving and noise reduction of 28nm CMOS RF system integration using integrated fan-out wafer level packaging (InFO-WLP) technology
Wang, Chuei-Tang, Hsieh, Jeng-Shien, Chang, Victor C. Y., Yeh, En-Hsiang, Kuo, Feng-Wei, Chen, Hsu-Hsien, Chen, Chih-Hua, Chen, Ron, Lu, Ying-Ta, Jou, Chewn-Pu, Tsai, Hao-Yi, Liu, C. S., Yu, Doug C. HYear:
2015
Language:
english
DOI:
10.1109/3dic.2015.7334573
File:
PDF, 1.12 MB
english, 2015