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[IEEE 63rd Device Research Conference Digest, 2005. DRC '05. - Santa Barbara, CA, USA (June 20-22, 2005)] 63rd Device Research Conference Digest, 2005. DRC '05. - Effect of tensile capping layer on 3-D stress profiles in FinFET channels
Kyoungsub Shin,, Lauderdale, T., Tsu-Jae King,Volume:
1
Year:
2005
Language:
english
DOI:
10.1109/drc.2005.1553120
File:
PDF, 1.10 MB
english, 2005