[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Flip chip interconnection using anisotropic conductive adhesives for RF and high frequency applications
Myung-Jin Yim,, In ho Jung,, Hyung-Kyu Choi,, Kijoong Kim,, Jia-Sang Hwang,, Jin-Yong Ahn,, Woonseong Kwon,, Kyung Wook Paik,Year:
2003
Language:
english
DOI:
10.1109/ectc.2003.1216477
File:
PDF, 535 KB
english, 2003