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[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - A thermal aging study on both Au-Cu and Au-Al wire-bonded interfaces
Chu-Chung Lee,, Tu-Anh Tran,, Yong, L., Harun, F., Yong, C.C.Year:
2003
Language:
english
DOI:
10.1109/ectc.2003.1216540
File:
PDF, 807 KB
english, 2003