[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Characterization of 3D stacked high resistivity Si interposers with polymer TSV liners for 3D RF module
Choi, Kwang-Seong, Lee, Haksun, Bae, Hyun-Cheol, Eom, Yong-Sung, Lee, Kangwook, Fukushima, Takafumi, Koyanagi, Mitsumasa, Lee, Jin HoYear:
2015
Language:
english
DOI:
10.1109/ectc.2015.7159705
File:
PDF, 1.08 MB
english, 2015