[IEEE 2014 IEEE Electrical Design of Advanced Packaging...

  • Main
  • [IEEE 2014 IEEE Electrical Design of...

[IEEE 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) - Bangalore, India (2014.12.14-2014.12.16)] 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) - Resonant power supply noise reduction using on-die decoupling capacitors embedded in organic interposer

Nakura, Toru, Kano, Masahiro, Yoshizawa, Masamitsu, Oyamada, Seisei, Hattori, Atsunori, Asada, Kunihiro
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2014
Language:
english
DOI:
10.1109/edaps.2014.7030823
File:
PDF, 1.04 MB
english, 2014
Conversion to is in progress
Conversion to is failed