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[IEEE 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) - Bangalore, India (2014.12.14-2014.12.16)] 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) - Resonant power supply noise reduction using on-die decoupling capacitors embedded in organic interposer
Nakura, Toru, Kano, Masahiro, Yoshizawa, Masamitsu, Oyamada, Seisei, Hattori, Atsunori, Asada, KunihiroYear:
2014
Language:
english
DOI:
10.1109/edaps.2014.7030823
File:
PDF, 1.04 MB
english, 2014