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[IEEE 4th International Symposium on Electronic Materials and Packaging - Kaohsiung, Taiwan (4-6 Dec. 2002)] Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. - Interfacial reaction between Sn-Ag-Cu, Sn-Ag-Cu-Ni-Ge lead-free solders and metallic substrates
Chiang-Ming Chuang,, Po-Cheng Shi,, Kwang-Lung Lin,Year:
2002
Language:
english
DOI:
10.1109/emap.2002.1188865
File:
PDF, 532 KB
english, 2002