Capacitance Enhanced Through-Silicon Via for Power...

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IEEE Electron Device Letters 2016

Capacitance Enhanced Through-Silicon Via for Power Distribution Networks in 3D ICs

Hwang, Chulsoon, Achkir, Brice, Fan, Jun
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Year:
2016
Language:
english
Journal:
IEEE Electron Device Letters
DOI:
10.1109/led.2016.2535123
File:
PDF, 664 KB
english, 2016
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