[IEEE European Workshop Materials for Advanced Metallization. MAM'97 Abstracts Booklet - Villard de Lans, France (1997.03.16-1997.03.19)] European Workshop Materials for Advanced Metallization, - Deposition of barrier layer and CVD copper under no exposed wafer conditions: adhesion performance and process integration
Braeckelmann, G., Manger, D., Seo, S.C., Beasor, S., Nijsten, S., Kaloyeros, A.E.Year:
1997
Language:
english
DOI:
10.1109/mam.1997.621047
File:
PDF, 176 KB
english, 1997