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Effects of Ag content on the interfacial reactions between liquid Sn-Ag-Cu solders and Cu substrates during soldering
Yang, Ming, Ji, Hongjun, Wang, Shuai, Ko, Yong-Ho, Lee, Chang-Woo, Wu, Jianxin, Li, MingyuLanguage:
english
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2016.03.177
Date:
March, 2016
File:
PDF, 2.36 MB
english, 2016