An experimental methodology for the study of co‐planarity...

Soldering & Surface Mount Technology 2010 / 02 Vol. 22; Iss. 1

An experimental methodology for the study of co‐planarity variation effects in anisotropic conductive adhesive assemblies

Dou, Guangbin, Whalley, David C., Liu, Changqing, Chan, Y.C.
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Volume:
22
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540911011015148
Date:
February, 2010
File:
PDF, 413 KB
english, 2010
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