A new under bump metallurgy for solder bump flip chip...

A new under bump metallurgy for solder bump flip chip applications

Kulojärvi, Kari, Kivilahti, Jorma
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Volume:
15
Language:
english
Journal:
Microelectronics International
DOI:
10.1108/13565369810370328
Date:
August, 1998
File:
PDF, 65 KB
english, 1998
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