Enabling Technologies for Low‐count Chip Packaging

Enabling Technologies for Low‐count Chip Packaging

Hashemi, H., Olla, M., Spooner, C., Walshak, D.
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Volume:
20
Language:
english
Journal:
Circuit World
DOI:
10.1108/eb046268
Date:
March, 1994
File:
PDF, 446 KB
english, 1994
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