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Non-destructive degradation study of copper wire bond for...

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Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation

Chan, Marvin, Tan, Cher Ming, Lee, Kheng Chooi, Tan, Chuan Seng
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Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2015.12.026
Date:
December, 2015
File:
PDF, 3.28 MB
english, 2015
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