[IEEE 2015 IEEE 17th Electronics Packaging and Technology...

  • Main
  • [IEEE 2015 IEEE 17th Electronics...

[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Enhance TCOB life for wafer level package with a new leadfree solder alloy

Zhang, Xueren, Goh, Wei Zhen, Wong, Kim-sing, Yap, Daniel, Goh, Kim-yong
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412371
File:
PDF, 912 KB
english, 2015
Conversion to is in progress
Conversion to is failed