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[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Enhance TCOB life for wafer level package with a new leadfree solder alloy
Zhang, Xueren, Goh, Wei Zhen, Wong, Kim-sing, Yap, Daniel, Goh, Kim-yongYear:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412371
File:
PDF, 912 KB
english, 2015