International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde)
2010 / 02 Vol. 101; Iss. 2
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Scaling effects on microstructure and reliability for Cu interconnects
Ho, Paul S., Zschech, Ehrenfried, Schmeisser, Dieter, Meyer, Moritz A., Huebner, Rene, Hauschildt, Meike, Zhang, Lijuan, Gall, Martin, Kraatz, MatthiasVolume:
101
Language:
english
Journal:
International Journal of Materials Research
DOI:
10.3139/146.110264
Date:
February, 2010
File:
PDF, 505 KB
english, 2010