[IEEE 2014 IEEE 20th International Symposium for Design and...

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[IEEE 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Bucharest, Romania (2014.10.23-2014.10.26)] 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Cooling with Mentor Graphics HyperLynx Thermal

Hnatiuc, Mihaela, Iov, Catalin J.
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Year:
2014
Language:
english
DOI:
10.1109/SIITME.2014.6967005
File:
PDF, 711 KB
english, 2014
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