Study on the ductile mode cutting of LiNbO3 wafer for...

International Journal of Abrasive Technology 2011 Vol. 4; Iss. 3

Study on the ductile mode cutting of LiNbO3 wafer for fabrication of SAW device

Shizuka, Hiroo, Okuda, Koichi, Nunobiki, Masayuki, Li, Wei, Inaoka, Takanobu
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Volume:
4
Year:
2011
Language:
english
Journal:
International Journal of Abrasive Technology
DOI:
10.1504/ijat.2011.042827
File:
PDF, 1.40 MB
english, 2011
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