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On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient
Kunwar, Anil, Ma, Haoran, Ma, Haitao, Sun, Junhao, Zhao, Ning, Huang, MingliangVolume:
172
Language:
english
Journal:
Materials Letters
DOI:
10.1016/j.matlet.2016.02.075
Date:
June, 2016
File:
PDF, 1.33 MB
english, 2016