On the increase of intermetallic compound's thickness at...

Materials Letters 2016 / 06 Vol. 172

On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient

Kunwar, Anil, Ma, Haoran, Ma, Haitao, Sun, Junhao, Zhao, Ning, Huang, Mingliang
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Volume:
172
Language:
english
Journal:
Materials Letters
DOI:
10.1016/j.matlet.2016.02.075
Date:
June, 2016
File:
PDF, 1.33 MB
english, 2016
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