Evaluation of hybrid bonding technology of single-micron...

Microelectronics Reliability 2016 / 04 Vol. 59

Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection

Ohyama, Masaki, Nimura, Masatsugu, Mizuno, Jun, Shoji, Shuichi, Nonaka, Toshihisa, Shinba, Yoichi, Shigetou, Akitsu
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Volume:
59
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2015.12.033
Date:
April, 2016
File:
PDF, 1.34 MB
english, 2016
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