Flatness enhancement of the embedded interposer of 3D-ICs by using ring-type framework designs
Lee, Chang-Chun, Cheng, Ren-Chin, Lin, Yu-Min, Liu, Hsing-Ning, Liou, Yan-Yu, Chang, Tao-Chih, Wang, Chien-PingVolume:
156
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2016.01.039
Date:
April, 2016
File:
PDF, 1.48 MB
english, 2016