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Atomistic Mechanisms of Chemical Mechanical Polishing of a Cu Surface in Aqueous H 2 O 2 : Tight-Binding Quantum Chemical Molecular Dynamics Simulations
Kawaguchi, Kentaro, Ito, Hiroshi, Kuwahara, Takuya, Higuchi, Yuji, Ozawa, Nobuki, Kubo, MomojiLanguage:
english
Journal:
ACS Applied Materials & Interfaces
DOI:
10.1021/acsami.5b11910
Date:
April, 2016
File:
PDF, 3.73 MB
english, 2016