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2-Mercaptopyridine as a new leveler for bottom-up filling of micro-vias in copper electroplating
Chang, Chun, Lu, Xubin, Lei, Zhanwu, Wang, Zenglin, Zhao, ChuanLanguage:
english
Journal:
Electrochimica Acta
DOI:
10.1016/j.electacta.2016.04.177
Date:
May, 2016
File:
PDF, 448 KB
english, 2016