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Thermal curing behavior of modified urea-formaldehyde resin adhesives with two formaldehyde scavengers and their influence on adhesion performance
Byung-Dae Park, Eun-Chang Kang, Jong-Young ParkVolume:
110
Year:
2008
Language:
english
Pages:
8
DOI:
10.1002/app.28748
File:
PDF, 209 KB
english, 2008