[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - On the failure mechanism in lead-free flip-chip interconnects comprising ENIG finish during electromigration
Gorywoda, Marek, Dohle, Rainer, Wirth, Andreas, Burger, Bernd, Gossler, JorgYear:
2015
Language:
english
DOI:
10.1109/ECTC.2015.7159881
File:
PDF, 1.08 MB
english, 2015