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Correlation between Special Grain Boundaries and Electromigration Behavior of Aluminum Thin Films
Lee, K. T., Szpunar, J. A., Morawiec, A., Knorr, D. B., Rodbell, K. P.Volume:
34
Language:
english
Journal:
Canadian Metallurgical Quarterly
DOI:
10.1179/cmq.1995.34.3.287
Date:
July, 1995
File:
PDF, 762 KB
english, 1995