TSV- and delay-aware 3D-IC floorplanning

Analog Integrated Circuits and Signal Processing 2016 / 5 Vol. 87; Iss. 2

TSV- and delay-aware 3D-IC floorplanning

Ahmed, Mohammad A., Mohapatra, S., Chrzanowska-Jeske, M.
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Volume:
87
Language:
english
Journal:
Analog Integrated Circuits and Signal Processing
DOI:
10.1007/s10470-016-0717-1
Date:
May, 2016
File:
PDF, 2.49 MB
english, 2016
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