3D resistive RAM cell design for high-density storage class...

SCIENCE CHINA Information Sciences 2016 / 6 Vol. 59; Iss. 6

3D resistive RAM cell design for high-density storage class memory—a review

Hudec, Boris, Hsu, Chung-Wei, Wang, I.-Ting, Lai, Wei-Li, Chang, Che-Chia, Wang, Taifang, Fröhlich, Karol, Ho, Chia-Hua, Lin, Chen-Hsi, Hou, Tuo-Hung
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Volume:
59
Language:
english
Journal:
Science China Information Sciences
DOI:
10.1007/s11432-016-5566-0
Date:
June, 2016
File:
PDF, 3.60 MB
english, 2016
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