Thermally curable adhesive tapes with complex catalyst system for fabricating semiconductor packages
Naoya Saiki, Emi Nakajima, Hironori Shizuhata, Hideo Seno, Kazuyoshi EbeVolume:
114
Year:
2009
Language:
english
Pages:
6
DOI:
10.1002/app.30469
File:
PDF, 197 KB
english, 2009