[IEEE 2015 IEEE 17th Electronics Packaging and Technology...

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[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Application of copper nanoparticles as die attachment for high power LED

Lee, Byung Hoon, Ng, Mei Zhen, Zinn, Alfred A., Gan, Chee Lip
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Year:
2015
Language:
english
DOI:
10.1109/EPTC.2015.7412383
File:
PDF, 4.99 MB
english, 2015
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