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Novel Lead-Free Sn-Cu-xBi Nanosolders by Chemical Reduction Method
Huang, Po-Chun, Duh, Jenq-GongVolume:
9
Language:
english
Journal:
Journal of Nanoscience and Nanotechnology
DOI:
10.1166/jnn.2009.C020
Date:
February, 2009
File:
PDF, 3.32 MB
english, 2009