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Electroplating Characteristics of Eutectic Sn–Cu Ions for Micro-Solder Bump on a Si Chip
Park, Jun-Kyu, Lee, Ki-Ju, Jung, Jae-PilVolume:
12
Language:
english
Journal:
Journal of Nanoscience and Nanotechnology
DOI:
10.1166/jnn.2012.5621
Date:
April, 2012
File:
PDF, 4.62 MB
english, 2012