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Residual stress in copper paste films on alumina substrates
Fukuda, S., Shimada, K., Izu, N., Shin, W., Hirao, K., Sandou, M., Murayama, N.Volume:
26
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-015-2953-z
Date:
July, 2015
File:
PDF, 800 KB
english, 2015