Full intermetallic joints for chip stacking by using...

Acta Materialia 2016 / 07 Vol. 113

Full intermetallic joints for chip stacking by using thermal gradient bonding

Yang, T.L., Aoki, T., Matsumoto, K., Toriyama, K., Horibe, A., Mori, H., Orii, Y., Wu, J.Y., Kao, C.R.
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Volume:
113
Language:
english
Journal:
Acta Materialia
DOI:
10.1016/j.actamat.2016.04.046
Date:
July, 2016
File:
PDF, 4.17 MB
english, 2016
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